쥐스킨트의 작은 서재

System in package

A system in package (SiP) or system-in-a-package is a number of integrated circuits enclosed in a single module (package). The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together.

SiP dies can be stacked vertically or tiled horizontally, unlike slightly less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solders bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with conductors running through the die.

Many different 3-D packaging techniques have been developed for stacking many more-or-less standard chip dies into a compact area.

An example SiP can contain several chips –such as a specialized processor, DRAM, flash memory – combined with passive components– resistors and  capacitors – all mounted on the same substrate. This means that a complete functional unit can be built in a multi-chip package, so that few external components need to be added to make it work.